LAB 01
Semiconductor & Microelectronics Packaging Lab
Hands-on training in chip packaging, PCB assembly, VLSI fundamentals and failure analysis — aligned with India's National Semiconductor Mission and PLI Scheme for electronics.
SMTBGAEDAX-rayIPC-A-610
$50B+
India ESDM Target 2026-30
85K+
Jobs in Pipeline
Your learning journey
Six steps from enrolment to certificate.
Focus areas
What you'll work on
- Wire bonding and die attach processes
- BGA rework and advanced soldering
- SMT assembly and reflow techniques
- PCB layout and multilayer design
- Chip packaging fundamentals (QFN, BGA, CSP)
- Inspection and defect detection methods
- Failure analysis and reliability testing
- Quality assurance and process optimization
Equipment & toolchain
Industry-grade infrastructure
- EDA workstations
- SMT rework stations
- X-ray inspection systems
- Soldering and desoldering trainers
- PCB prototyping machines
- Digital microscopes and inspection tools
- Oscilloscopes and test equipment
- Thermal profiling and testing systems
Learner outcomes
Skills & certifications you walk away with
- PCB design using latest softwares
- SMT assembly and rework certification
- Failure analysis and debugging skills
- IPC-A-610 quality standards knowledge
- Hands-on chip packaging exposure
- Inspection and testing expertise
- Industry-ready manufacturing skills
- Capability in electronics system integration
Industry partners
Where this lab places talent
ESDM companiesSemiconductor fabsOSAT (Outsourced Assembly & Testing) unitsDefense electronics sectorAerospace electronicsPLI scheme beneficiariesElectronics manufacturing clustersMSMEs and hardware startups
Curriculum
4 modules.
Take qualification →
Auto-graded final MCQ · 70% to pass
Module 01
Foundations of Semiconductor Packaging
Materials, package families, and the physics of die attach.
12m · 4 lessons
Module 02
PCB Design & Multilayer Layout
From schematic capture to a manufacturable, signal-integrity-clean board.
12m · 4 lessons
Module 03
SMT Assembly, Reflow & Rework
Build a board on real lines and rework BGAs without damage.
12m · 4 lessons
Module 04
Inspection, Test & Failure Analysis
Find defects fast, then trace them to root cause.
12m · 4 lessons
Final assessment
10 questions · pass mark 70% · unlocks certificate