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LMS/Semiconductor & Microelectronics Packaging Lab/Module 01

Module 01 of 4

Foundations of Semiconductor Packaging

Materials, package families, and the physics of die attach.

4 lessons
  1. 01

    Why packaging matters: from die to product

  2. 02

    Die attach: epoxy, eutectic and sintering

  3. 03

    Wire bonding fundamentals

  4. 04

    Lab walkthrough: identifying QFN, BGA and CSP

All modules